DE02024 Dreyer Electronics LLC
Hersteller: Dreyer Electronics LLCDescription: SOP-24/SSOP-24/SOIC-24 TO DIP-24
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
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Technische Details DE02024 Dreyer Electronics LLC
Description: SOP-24/SSOP-24/SOIC-24 TO DIP-24, Packaging: Bag, Material: FR4 Epoxy Glass, Number of Positions: 24, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, SOP, SSOP, Part Status: Active.