DF12(3.0)-32DS-0.5V(86) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 32POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 3mm
Contact Finish Thickness: 8.00µin (0.203µm)
Height Above Board: 0.087" (2.20mm)
Pitch: 0.020" (0.50mm)
Number of Positions: 32
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
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Technische Details DF12(3.0)-32DS-0.5V(86) Hirose Electric Co Ltd
Description: CONN RCPT 32POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 3mm, Contact Finish Thickness: 8.00µin (0.203µm), Height Above Board: 0.087" (2.20mm), Pitch: 0.020" (0.50mm), Number of Positions: 32, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote DF12(3.0)-32DS-0.5V(86)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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DF12(3.0)-32DS-0.5V(86) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 32POS SMD GOLDNumber of Rows: 2 Mated Stacking Heights: 3mm Contact Finish Thickness: 8.00µin (0.203µm) Height Above Board: 0.087" (2.20mm) Pitch: 0.020" (0.50mm) Number of Positions: 32 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
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DF12(3.0)-32DS-0.5V(86) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 32P V SMT DR RECPT 3.0MM STACK HT GOLD |
Produkt ist nicht verfügbar |
