
DF12B(3.0)-10DS-0.5V(86) Hirose Connector

Board to Board & Mezzanine Connectors 10P V SMT DR RECPT 3.0MM STKHT W/O BOSS
auf Bestellung 1960 Stücke:
Lieferzeit 10-14 Tag (e)
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Technische Details DF12B(3.0)-10DS-0.5V(86) Hirose Connector
Description: CONN RCPT 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.020" (0.50mm), Height Above Board: 0.087" (2.20mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 3mm, Number of Rows: 2.
Weitere Produktangebote DF12B(3.0)-10DS-0.5V(86)
Foto | Bezeichnung | Hersteller | Beschreibung |
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DF12B(3.0)-10DS-0.5V(86) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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DF12B(3.0)-10DS-0.5V(86) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.020" (0.50mm) Height Above Board: 0.087" (2.20mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |