DF15(0.8)-30DS-0.65V(56) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 30P RECP .8MM HEIGHT W/FITTING AND BOSS
Board to Board & Mezzanine Connectors 30P RECP .8MM HEIGHT W/FITTING AND BOSS
auf Bestellung 822 Stücke:
Lieferzeit 14-28 Tag (e)
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Technische Details DF15(0.8)-30DS-0.65V(56) Hirose Connector
Description: CONN RCPT 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.026" (0.65mm), Height Above Board: 0.118" (3.00mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 4mm, 5mm, 7mm, Part Status: Obsolete, Number of Rows: 2.
Weitere Produktangebote DF15(0.8)-30DS-0.65V(56)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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DF15(0.8)-30DS-0.65V(56) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.026" (0.65mm) Height Above Board: 0.118" (3.00mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 4mm, 5mm, 7mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |
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DF15(0.8)-30DS-0.65V(56) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.026" (0.65mm) Height Above Board: 0.118" (3.00mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 4mm, 5mm, 7mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |