DF15(0.8)-30DS-0.65V(56) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 30P RECP .8MM HEIGHT W/FITTING AND BOSS
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Technische Details DF15(0.8)-30DS-0.65V(56) Hirose Connector
Description: CONN RCPT 30POS SMD GOLD, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.026" (0.65mm), Height Above Board: 0.118" (3.00mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 4mm, 5mm, 7mm, Part Status: Obsolete, Number of Rows: 2.
Weitere Produktangebote DF15(0.8)-30DS-0.65V(56)
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
DF15(0.8)-30DS-0.65V(56) | Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.026" (0.65mm) Height Above Board: 0.118" (3.00mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 4mm, 5mm, 7mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| DF15(0.8)-30DS-0.65V(56) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Height Above Board: 0.118" (3.00mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 4mm, 5mm, 7mm
Part Status: Obsolete
Number of Rows: 2
Description: CONN RCPT 30POS SMD GOLD
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Height Above Board: 0.118" (3.00mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 4mm, 5mm, 7mm
Part Status: Obsolete
Number of Rows: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH