DF30FB-30DS-0.4V(82) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.035" (0.88mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.9mm
Number of Rows: 2
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.035" (0.88mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.9mm
Number of Rows: 2
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.13 EUR |
10+ | 1.8 EUR |
25+ | 1.72 EUR |
50+ | 1.68 EUR |
100+ | 1.61 EUR |
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Produktbewertung abgeben
Technische Details DF30FB-30DS-0.4V(82) Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.035" (0.88mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.9mm, Number of Rows: 2.
Weitere Produktangebote DF30FB-30DS-0.4V(82)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
DF30FB-30DS-0.4V(82) | Hersteller : Hirose Connector | Board to Board & Mezzanine Connectors 30P DR SMT RECEPT W/FITTING, NO BOSS |
auf Bestellung 1618 Stücke: Lieferzeit 14-28 Tag (e) |
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DF30FB-30DS-0.4V(82) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.035" (0.88mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.9mm Number of Rows: 2 |
Produkt ist nicht verfügbar |