
DF9-19S-1V(32) Hirose Connector

Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 19P TIN PLATING
auf Bestellung 6778 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 2.13 EUR |
10+ | 1.50 EUR |
100+ | 1.30 EUR |
500+ | 1.22 EUR |
1000+ | 1.15 EUR |
2000+ | 1.07 EUR |
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Technische Details DF9-19S-1V(32) Hirose Connector
Description: CONN RCPT 19POS SMD TIN, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 19, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Weitere Produktangebote DF9-19S-1V(32) nach Preis ab 1.22 EUR bis 2.13 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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DF9-19S-1V(32) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 19 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
auf Bestellung 1715 Stücke: Lieferzeit 10-14 Tag (e) |
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DF9-19S-1V(32) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 19 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |