DF9-23P-1V(32) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 23P TIN PLATING
| Anzahl | Preis |
|---|---|
| 2+ | 2.11 EUR |
| 1000+ | 1.15 EUR |
| 5000+ | 1.14 EUR |
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Technische Details DF9-23P-1V(32) Hirose Connector
Description: CONN HDR 23POS SMD TIN, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 23, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Header, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Number of Rows: 2, Mated Stacking Heights: 4.3mm.
Weitere Produktangebote DF9-23P-1V(32)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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DF9-23P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 23POS SMD TIN Contact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 23 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Header, Center Strip Contacts Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Number of Rows: 2 Mated Stacking Heights: 4.3mm |
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