DF9-23P-1V(32) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 1.0MM V SMT HEADER 23P TIN PLATING
auf Bestellung 893 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.32 EUR |
| 500+ | 2.27 EUR |
| 1000+ | 1.19 EUR |
| 5000+ | 1.16 EUR |
| 10000+ | 1.15 EUR |
| 25000+ | 1.13 EUR |
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Technische Details DF9-23P-1V(32) Hirose Connector
Description: CONN HDR 23POS SMD TIN, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 23, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Weitere Produktangebote DF9-23P-1V(32)
| Foto | Bezeichnung | Hersteller | Beschreibung |
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DF9-23P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 23POS SMD TIN Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 23 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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DF9-23P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 23POS SMD TIN Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 23 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |