DF9-23P-1V(32) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 1.0MM V SMT HEADER 23P TIN PLATING
auf Bestellung 933 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 16+ | 3.35 EUR |
| 18+ | 2.94 EUR |
| 100+ | 2.63 EUR |
| 500+ | 2.18 EUR |
| 1000+ | 1.9 EUR |
| 10000+ | 1.88 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DF9-23P-1V(32) Hirose Connector
Description: CONN HDR 23POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 23, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Weitere Produktangebote DF9-23P-1V(32)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
DF9-23P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 23POS SMD TIN Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 23 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
|
|
|
DF9-23P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 23POS SMD TIN Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 23 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |