Produkte > HIROSE CONNECTOR > DF9B-13P-1V(32)
DF9B-13P-1V(32)

DF9B-13P-1V(32) Hirose Connector


DF9_Catalog_D31692_en-2301602.pdf Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 13P TIN PLT MTL FIT
auf Bestellung 2955 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
18+2.96 EUR
21+ 2.51 EUR
100+ 2.26 EUR
500+ 1.85 EUR
1000+ 1.53 EUR
2000+ 1.51 EUR
10000+ 1.36 EUR
Mindestbestellmenge: 18
Produktrezensionen
Produktbewertung abgeben

Technische Details DF9B-13P-1V(32) Hirose Connector

Description: CONN HDR 13POS SMD TIN, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 13, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Part Status: Active, Number of Rows: 2.

Weitere Produktangebote DF9B-13P-1V(32)

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
DF9B-13P-1V(32) DF9B-13P-1V(32) Hersteller : Hirose Electric Co Ltd DF9.pdf Description: CONN HDR 13POS SMD TIN
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 13
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
DF9B-13P-1V(32) DF9B-13P-1V(32) Hersteller : Hirose Electric Co Ltd DF9.pdf Description: CONN HDR 13POS SMD TIN
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 13
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar