| Anzahl | Preis |
|---|---|
| 3+ | 1.01 EUR |
| 10+ | 0.81 EUR |
| 24+ | 0.77 EUR |
| 120+ | 0.74 EUR |
| 264+ | 0.69 EUR |
| 504+ | 0.66 EUR |
| 1008+ | 0.61 EUR |
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Technische Details DILB20P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 20POS TIN, Part Status: Active, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote DILB20P-223TLF nach Preis ab 0.63 EUR bis 1.11 EUR
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DILB20P-223TLF | Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 20POS TINPart Status: Active Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 7680 Stücke: Lieferzeit 10-14 Tag (e) |
|
| DILB20P-223TLF |
|
Hersteller: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 20POS TIN
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 20POS TIN
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 7680 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 16+ | 1.11 EUR |
| 24+ | 0.88 EUR |
| 48+ | 0.84 EUR |
| 72+ | 0.81 EUR |
| 120+ | 0.78 EUR |
| 264+ | 0.74 EUR |
| 504+ | 0.71 EUR |
| 1008+ | 0.67 EUR |
| 2520+ | 0.63 EUR |