DILB40P-223TLF Amphenol FCI
| Anzahl | Preis |
|---|---|
| 2+ | 1.95 EUR |
| 12+ | 1.11 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DILB40P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 40POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyamide (PA), Nylon, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Weitere Produktangebote DILB40P-223TLF nach Preis ab 1.22 EUR bis 2.13 EUR
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DILB40P-223TLF | Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 40POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA), Nylon Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy Part Status: Active |
auf Bestellung 4494 Stücke: Lieferzeit 10-14 Tag (e) |
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DILB40P-223TLF | AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB40P-223TLF - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Kupferlegierung tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y Anzahl der Kontakte: 40Kontakt(e) SVHC: No SVHC (17-Jan-2023) Reihenabstand: 15.24mm Steckverbinder: DIP-Sockel Produktpalette: - productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 8528 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| DILB40P-223TLF |
|
Hersteller: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 40POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
auf Bestellung 4494 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9+ | 2.13 EUR |
| 12+ | 1.78 EUR |
| 36+ | 1.65 EUR |
| 60+ | 1.59 EUR |
| 108+ | 1.53 EUR |
| 252+ | 1.44 EUR |
| 504+ | 1.37 EUR |
| 1008+ | 1.31 EUR |
| 2508+ | 1.22 EUR |
| DILB40P-223TLF |
|
Hersteller: AMPHENOL COMMUNICATIONS SOLUTIONS
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB40P-223TLF - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Kupferlegierung
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (17-Jan-2023)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB40P-223TLF - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Kupferlegierung
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Anzahl der Kontakte: 40Kontakt(e)
SVHC: No SVHC (17-Jan-2023)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 8528 Stücke:
Lieferzeit 14-21 Tag (e)Im Einkaufswagen Stück im Wert von UAH