DIP300-SOIC-08W Chip Quik
Hersteller: Chip Quik
Sockets & Adapters DIP-08 (DIP-8) (0.3" width, 0.1" pitch) to SOIC-8 Wide (1.27mm pitch, 300 mil body) Adapter
Produktrezensionen
Produktbewertung abgeben
Technische Details DIP300-SOIC-08W Chip Quik
Description: ADAPTER BOARD DIP TO SMD, Packaging: Bulk, Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to SMD, Package Accepted: DIP.
Weitere Produktangebote DIP300-SOIC-08W nach Preis ab 12.33 EUR bis 17.14 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
DIP300-SOIC-08W | Chip Quik Inc. |
Description: ADAPTER BOARD DIP TO SMD Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to SMD Package Accepted: DIP |
auf Bestellung 68 Stücke: Lieferzeit 10-14 Tag (e) |
|
| DIP300-SOIC-08W |
|
Hersteller: Chip Quik Inc.
Description: ADAPTER BOARD DIP TO SMD
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
Description: ADAPTER BOARD DIP TO SMD
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 17.14 EUR |
| 5+ | 14.78 EUR |
| 10+ | 13.95 EUR |
| 25+ | 12.97 EUR |
| 50+ | 12.33 EUR |