DIP300-SOIC-12W Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DIP-12 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
| Anzahl | Preis |
|---|---|
| 2+ | 15.68 EUR |
| 5+ | 13.54 EUR |
| 10+ | 12.78 EUR |
| 25+ | 11.9 EUR |
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Technische Details DIP300-SOIC-12W Chip Quik Inc.
Description: DIP-12 (0.3" WIDTH, 0.1" PITCH), Packaging: Bulk, Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 12, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC.
Weitere Produktangebote DIP300-SOIC-12W
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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DIP300-SOIC-12W | Hersteller : Chip Quik |
IC & Component Sockets DIP-12 (0.3" width, 0.1" pitch) to SOIC-12 Wide (1.27mm pitch, 300 mil body) Adapter |
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