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DIP300T600P04

DIP300T600P04 Chip Quik Inc.

DIP300T600P04.pdf Hersteller: Chip Quik Inc.
Description: DIP-4 (0.3" BODY) TO DIP-4 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
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Technische Details DIP300T600P04 Chip Quik Inc.

Description: DIP-4 (0.3" BODY) TO DIP-4 (0.6", Packaging: Bulk, Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm), Material: FR4 Epoxy Glass, Number of Positions: 4, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.