DIP300T600P18 Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: DIP-18 (0.3" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6 EUR |
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Technische Details DIP300T600P18 Chip Quik Inc.
Description: DIP-18 (0.3" BODY) TO DIP-18 (0., Packaging: Bulk, Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 18, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.