DIP300T600P20 Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: DIP TO DIP 20PIN UNASSEMBLED
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.74 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DIP300T600P20 Chip Quik Inc.
Description: DIP TO DIP 20PIN UNASSEMBLED, Packaging: Bulk, Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 20, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.