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DIP300T600P22

DIP300T600P22 Chip Quik Inc.

DIP300T600P22.pdf
Hersteller: Chip Quik Inc.
Description: DIP-22 (0.3" BODY) TO DIP-22 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 22
Material: FR4 Epoxy Glass
Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm)
Packaging: Bulk
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Technische Details DIP300T600P22 Chip Quik Inc.

Description: DIP-22 (0.3" BODY) TO DIP-22 (0., Part Status: Active, Proto Board Type: DIP to DIP, Board Thickness: 0.063" (1.60mm), Pitch: 0.100" (2.54mm), Number of Positions: 22, Material: FR4 Epoxy Glass, Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm), Packaging: Bulk.