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DIP600T300P08

DIP600T300P08 Chip Quik Inc.

DIP600T300P08.pdf
Hersteller: Chip Quik Inc.
Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
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Technische Details DIP600T300P08 Chip Quik Inc.

Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3", Part Status: Active, Proto Board Type: DIP to DIP, Board Thickness: 0.063" (1.60mm), Pitch: 0.100" (2.54mm), Number of Positions: 8, Material: FR4 Epoxy Glass, Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm), Packaging: Bulk.