Produkte > CHIP QUIK INC. > DIP600T300P08
DIP600T300P08

DIP600T300P08 Chip Quik Inc.

DIP600T300P08.pdf Hersteller: Chip Quik Inc.
Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details DIP600T300P08 Chip Quik Inc.

Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3", Packaging: Bulk, Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.