DIP600T300P26 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DIP-26 (0.6" BODY) TO DIP-26 (0.
Part Status: Active
Proto Board Type: DIP to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 26
Material: FR4 Epoxy Glass
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Packaging: Bulk
Produktrezensionen
Produktbewertung abgeben
Technische Details DIP600T300P26 Chip Quik Inc.
Description: DIP-26 (0.6" BODY) TO DIP-26 (0., Part Status: Active, Proto Board Type: DIP to DIP, Board Thickness: 0.063" (1.60mm), Pitch: 0.100" (2.54mm), Number of Positions: 26, Material: FR4 Epoxy Glass, Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm), Packaging: Bulk.