DR127D254P24F Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DUAL ROW 1.27MM PITCH 24-PIN FEM
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Connector to DIP
Package Accepted: 1.27mm Header
Description: DUAL ROW 1.27MM PITCH 24-PIN FEM
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Connector to DIP
Package Accepted: 1.27mm Header
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Technische Details DR127D254P24F Chip Quik Inc.
Description: DUAL ROW 1.27MM PITCH 24-PIN FEM, Packaging: Bulk, Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 24, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: Connector to DIP, Package Accepted: 1.27mm Header.