DR127DR254P12 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DUAL ROW 1.27MM PITCH 12-PIN TO
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: 1.27mm Connector
Description: DUAL ROW 1.27MM PITCH 12-PIN TO
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: 1.27mm Connector
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Technische Details DR127DR254P12 Chip Quik Inc.
Description: DUAL ROW 1.27MM PITCH 12-PIN TO, Packaging: Bulk, Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm), Material: FR4 Epoxy Glass, Number of Positions: 12, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: 1.27mm Connector.