DSC6001JI3B-259K200T Microchip Technology
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Active
Frequency: 259.2 kHz
Base Resonator: MEMS
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tape & Reel (TR)
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Active
Frequency: 259.2 kHz
Base Resonator: MEMS
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Technische Details DSC6001JI3B-259K200T Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS, Packaging: Tape & Reel (TR), Package / Case: 4-VLGA, Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm), Mounting Type: Surface Mount, Output: CMOS, Function: Enable/Disable, Type: XO (Standard), Operating Temperature: -40°C ~ 85°C, Frequency Stability: ±20ppm, Voltage - Supply: 1.71V ~ 3.63V, Ratings: AEC-Q100, Current - Supply (Max): 1.3mA (Typ), Height - Seated (Max): 0.035" (0.89mm), Part Status: Active, Frequency: 259.2 kHz, Base Resonator: MEMS.