Technische Details EA-350-H245-T710 BOYD
Category: Heatsinks, Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm, Application: BGA; FPGA, Material finishing: anodized, Type of heatsink: extruded, Heatsink shape: grilled, Material: aluminium; plastic, Length: 35mm, Width: 35mm, Height: 24.5mm, Colour: black.
Weitere Produktangebote EA-350-H245-T710
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| EA-350-H245-T710 | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm Application: BGA; FPGA Material finishing: anodized Type of heatsink: extruded Heatsink shape: grilled Material: aluminium; plastic Length: 35mm Width: 35mm Height: 24.5mm Colour: black |
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