ECM8PO ETI POLAM
Hersteller: ETI POLAM
Category: Modular Aparatus Enclosures
Description: Enclosure: for modular components; IP40; plaster embedded; white
Manufacturer series: ECM
IP rating: IP40
Operating temperature: -25...60°C
Mounting: plaster embedded
Kit contents: screw terminals N/PE
Cover colour: white
Body colour: white
Dimension Z: 99mm
Dimension X: 211mm
Dimension Y: 232mm
Number of rows: 1
Number of modules: 8
Modules arrangement: 8
Enclosure material: ABS
Enclosures application: DIN rail modules; overcurrent breaker; RCD breaker
Type of enclosure: for modular components
Conform to the norm: IEC 60670-24; PN EN 60670-1
Protection class: II
Category: Modular Aparatus Enclosures
Description: Enclosure: for modular components; IP40; plaster embedded; white
Manufacturer series: ECM
IP rating: IP40
Operating temperature: -25...60°C
Mounting: plaster embedded
Kit contents: screw terminals N/PE
Cover colour: white
Body colour: white
Dimension Z: 99mm
Dimension X: 211mm
Dimension Y: 232mm
Number of rows: 1
Number of modules: 8
Modules arrangement: 8
Enclosure material: ABS
Enclosures application: DIN rail modules; overcurrent breaker; RCD breaker
Type of enclosure: for modular components
Conform to the norm: IEC 60670-24; PN EN 60670-1
Protection class: II
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 71.5 EUR |
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Technische Details ECM8PO ETI POLAM
Category: Modular Aparatus Enclosures, Description: Enclosure: for modular components; IP40; plaster embedded; white, Manufacturer series: ECM, IP rating: IP40, Operating temperature: -25...60°C, Mounting: plaster embedded, Kit contents: screw terminals N/PE, Cover colour: white, Body colour: white, Dimension Z: 99mm, Dimension X: 211mm, Dimension Y: 232mm, Number of rows: 1, Number of modules: 8, Modules arrangement: 8, Enclosure material: ABS, Enclosures application: DIN rail modules; overcurrent breaker; RCD breaker, Type of enclosure: for modular components, Conform to the norm: IEC 60670-24; PN EN 60670-1, Protection class: II.