ED08DT

ED08DT On Shore Technology Inc.


ipg2.pdf Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 8298 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
59+0.3 EUR
70+0.25 EUR
75+0.24 EUR
80+0.22 EUR
120+0.21 EUR
300+0.2 EUR
540+0.19 EUR
1020+0.18 EUR
2520+0.17 EUR
Mindestbestellmenge: 59
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details ED08DT On Shore Technology Inc.

Description: CONN IC DIP SOCKET 8POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 110°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.