ED18DT On Shore Technology Inc.
Hersteller: On Shore Technology Inc.Description: CONN IC DIP SOCKET 18POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 3251 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 42+ | 0.42 EUR |
| 51+ | 0.35 EUR |
| 57+ | 0.31 EUR |
| 61+ | 0.29 EUR |
| 104+ | 0.27 EUR |
| 260+ | 0.24 EUR |
| 520+ | 0.23 EUR |
| 1014+ | 0.19 EUR |
| 2522+ | 0.17 EUR |
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Technische Details ED18DT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 18POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 110°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote ED18DT
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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ED18DT | Hersteller : On-Shore Technology, Inc |
Conn DIP Socket SKT 18 POS Solder ST Thru-Hole |
Produkt ist nicht verfügbar |