ED18DT On Shore Technology Inc.
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
Produktrezensionen
Produktbewertung abgeben
Technische Details ED18DT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 18POS TIN, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 110°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote ED18DT
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
|
|
ED18DT | On Shore Technology Inc. |
Description: CONN IC DIP SOCKET 18POS TIN Part Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 60.0µin (1.52µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 110°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| ED18DT |
|
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 18POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 110°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 18POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 110°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH