ED24DT On Shore Technology Inc.
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 24POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
| Anzahl | Privatkunde |
|---|---|
| 17+ | 1.3 EUR |
| 20+ | 1.06 EUR |
| 40+ | 1.01 EUR |
| 60+ | 0.98 EUR |
| 100+ | 0.95 EUR |
| 260+ | 0.88 EUR |
| 500+ | 0.84 EUR |
| 1000+ | 0.81 EUR |
| 2500+ | 0.75 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
17 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details ED24DT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 24POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 110°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.