EFPLA63J273B022LH Eaton - Electronics Division
Hersteller: Eaton - Electronics DivisionDescription: CAP FILM 0.027UF 5% 630VDC RAD
Tolerance: ±5%
Packaging: Bulk
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 105°C
Applications: Automotive; High Frequency, Switching; High Pulse, DV/DT
Lead Spacing: 0.591" (15.00mm)
Termination: PC Pins
Ratings: AEC-Q200
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - DC: 630V
Height - Seated (Max): 0.492" (12.50mm)
Capacitance: 0.027 µF
ESR (Equivalent Series Resistance): 25 mOhms
Size / Dimension: 0.709" L x 0.236" W (18.00mm x 6.00mm)
auf Bestellung 867 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.36 EUR |
| 10+ | 2.14 EUR |
| 50+ | 1.65 EUR |
| 100+ | 1.50 EUR |
| 500+ | 1.24 EUR |
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Technische Details EFPLA63J273B022LH Eaton - Electronics Division
Description: CAP FILM 0.027UF 5% 630VDC RAD, Tolerance: ±5%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -55°C ~ 105°C, Applications: Automotive; High Frequency, Switching; High Pulse, DV/DT, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Ratings: AEC-Q200, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - DC: 630V, Height - Seated (Max): 0.492" (12.50mm), Capacitance: 0.027 µF, ESR (Equivalent Series Resistance): 25 mOhms, Size / Dimension: 0.709" L x 0.236" W (18.00mm x 6.00mm).