EFPLS63J105D122LH Bussmann / Eaton
auf Bestellung 170 Stücke:
Lieferzeit 94-98 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 9.31 EUR |
| 10+ | 8.03 EUR |
| 50+ | 7.99 EUR |
| 170+ | 6.78 EUR |
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Technische Details EFPLS63J105D122LH Bussmann / Eaton
Description: CAP FILM 1UF 5% 630VDC RAD, Packaging: Bulk, Tolerance: ±5%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 105°C, Applications: High Frequency, Switching; High Pulse, DV/DT, Lead Spacing: 1.083" (27.50mm), Termination: PC Pins, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - DC: 630V, Height - Seated (Max): 1.331" (33.80mm), Capacitance: 1 µF, ESR (Equivalent Series Resistance): 7 mOhms, Size / Dimension: 1.260" L x 0.709" W (32.00mm x 18.00mm).
Weitere Produktangebote EFPLS63J105D122LH
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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EFPLS63J105D122LH | Hersteller : Eaton - Electronics Division |
Description: CAP FILM 1UF 5% 630VDC RAD Packaging: Bulk Tolerance: ±5% Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Applications: High Frequency, Switching; High Pulse, DV/DT Lead Spacing: 1.083" (27.50mm) Termination: PC Pins Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - DC: 630V Height - Seated (Max): 1.331" (33.80mm) Capacitance: 1 µF ESR (Equivalent Series Resistance): 7 mOhms Size / Dimension: 1.260" L x 0.709" W (32.00mm x 18.00mm) |
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