EFPLS63J183B012LH Bussmann / Eaton
auf Bestellung 1054 Stücke:
Lieferzeit 94-98 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 1.72 EUR |
| 10+ | 1.3 EUR |
| 100+ | 0.97 EUR |
| 1054+ | 0.82 EUR |
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Technische Details EFPLS63J183B012LH Bussmann / Eaton
Description: CAP FILM 0.018UF 5% 630VDC RAD, Tolerance: ±5%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 105°C, Applications: High Frequency, Switching; High Pulse, DV/DT, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - DC: 630V, Height - Seated (Max): 0.453" (11.50mm), Capacitance: 0.018 µF, ESR (Equivalent Series Resistance): 35 mOhms, Size / Dimension: 0.709" L x 0.197" W (18.00mm x 5.00mm).
Weitere Produktangebote EFPLS63J183B012LH
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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EFPLS63J183B012LH | Hersteller : Eaton - Electronics Division |
Description: CAP FILM 0.018UF 5% 630VDC RAD Tolerance: ±5% Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Applications: High Frequency, Switching; High Pulse, DV/DT Lead Spacing: 0.591" (15.00mm) Termination: PC Pins Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - DC: 630V Height - Seated (Max): 0.453" (11.50mm) Capacitance: 0.018 µF ESR (Equivalent Series Resistance): 35 mOhms Size / Dimension: 0.709" L x 0.197" W (18.00mm x 5.00mm) |
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