EFPLS63J473B072LH Bussmann / Eaton
auf Bestellung 697 Stücke:
Lieferzeit 94-98 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 2.31 EUR |
10+ | 1.74 EUR |
100+ | 1.3 EUR |
500+ | 1.04 EUR |
697+ | 0.91 EUR |
2788+ | 0.85 EUR |
5576+ | 0.82 EUR |
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Technische Details EFPLS63J473B072LH Bussmann / Eaton
Description: CAP FILM 0.047UF 5% 630VDC RAD, Tolerance: ±5%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 105°C, Applications: High Frequency, Switching; High Pulse, DV/DT, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - DC: 630V, Height - Seated (Max): 0.551" (14.00mm), Capacitance: 0.047 µF, ESR (Equivalent Series Resistance): 15 MOhms, Size / Dimension: 0.709" L x 0.295" W (18.00mm x 7.50mm).
Weitere Produktangebote EFPLS63J473B072LH
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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EFPLS63J473B072LH | Hersteller : Eaton - Electronics Division |
Description: CAP FILM 0.047UF 5% 630VDC RAD Tolerance: ±5% Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Applications: High Frequency, Switching; High Pulse, DV/DT Lead Spacing: 0.591" (15.00mm) Termination: PC Pins Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - DC: 630V Height - Seated (Max): 0.551" (14.00mm) Capacitance: 0.047 µF ESR (Equivalent Series Resistance): 15 MOhms Size / Dimension: 0.709" L x 0.295" W (18.00mm x 7.50mm) |
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