EFX1S35K475E112LH Bussmann / Eaton
auf Bestellung 98 Stücke:
Lieferzeit 73-77 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 12.06 EUR |
| 10+ | 10.7 EUR |
| 50+ | 9.36 EUR |
| 98+ | 8.55 EUR |
| 588+ | 7.36 EUR |
| 1078+ | 6.95 EUR |
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Technische Details EFX1S35K475E112LH Bussmann / Eaton
Description: CAP FILM 4.7UF 10% 350VAC RAD, Tolerance: ±10%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 1.476" (37.50mm), Termination: PC Pins, Ratings: X1, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 350V, Voltage Rating - DC: 700V, Height - Seated (Max): 1.496" (38.00mm), Capacitance: 4.7 µF, Size / Dimension: 1.654" L x 0.866" W (42.00mm x 22.00mm).
Weitere Produktangebote EFX1S35K475E112LH
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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EFX1S35K475E112LH | Hersteller : Eaton - Electronics Division |
 Description: CAP FILM 4.7UF 10% 350VAC RADTolerance: ±10% Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: EMI, RFI Suppression Lead Spacing: 1.476" (37.50mm) Termination: PC Pins Ratings: X1 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 350V Voltage Rating - DC: 700V Height - Seated (Max): 1.496" (38.00mm) Capacitance: 4.7 µF Size / Dimension: 1.654" L x 0.866" W (42.00mm x 22.00mm) |
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