
EFX2S30K474C022LH Eaton - Electronics Division

Description: CAP FILM 0.47UF 10% 630VDC RAD
Tolerance: ±10%
Packaging: Bulk
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 110°C
Applications: EMI, RFI Suppression
Lead Spacing: 0.886" (22.50mm)
Termination: PC Pins
Ratings: X2
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - AC: 305V
Voltage Rating - DC: 630V
Height - Seated (Max): 0.669" (17.00mm)
Part Status: Active
Capacitance: 0.47 µF
Size / Dimension: 1.024" L x 0.276" W (26.00mm x 7.00mm)
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
13+ | 1.46 EUR |
20+ | 0.89 EUR |
50+ | 0.67 EUR |
100+ | 0.60 EUR |
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Technische Details EFX2S30K474C022LH Eaton - Electronics Division
Description: CAP FILM 0.47UF 10% 630VDC RAD, Tolerance: ±10%, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Ratings: X2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Height - Seated (Max): 0.669" (17.00mm), Part Status: Active, Capacitance: 0.47 µF, Size / Dimension: 1.024" L x 0.276" W (26.00mm x 7.00mm).
Weitere Produktangebote EFX2S30K474C022LH
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
EFX2S30K474C022LH | Hersteller : Bussmann / Eaton |
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