EP2AGX125DF25I3 Intel

Description: IC FPGA 260 I/O 572FBGA, Packaging: Tray, Package / Case: 572-BGA, FCBGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.87V ~ 0.93V, Number of Logic Elements/Cells: 118143, Supplier Device Package: 572-FBGA, FC (25x25), Number of LABs/CLBs: 4964, Total RAM Bits: 8315904, Part Status: Obsolete, Number of I/O: 260, DigiKey Programmable: Not Verified.