EP2AGX45DF29I3NAD Intel
Hersteller: Intel
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details EP2AGX45DF29I3NAD Intel
Description: IC FPGA 364 I/O 780FBGA, Packaging: Tray, Package / Case: 780-BBGA, FCBGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.87V ~ 0.93V, Number of Logic Elements/Cells: 42959, Supplier Device Package: 780-FBGA (29x29), Number of LABs/CLBs: 1805, Total RAM Bits: 3517440, Part Status: Obsolete, Number of I/O: 364, DigiKey Programmable: Not Verified.