Technische Details EP2AGX65DF25C6NES Intel
Description: IC FPGA 252 I/O 572FBGA, Packaging: Tray, Package / Case: 572-BGA, FCBGA, Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 0.87V ~ 0.93V, Number of Logic Elements/Cells: 60214, Supplier Device Package: 572-FBGA, FC (25x25), Number of LABs/CLBs: 2530, Total RAM Bits: 5371904, Number of I/O: 252, DigiKey Programmable: Not Verified.
Weitere Produktangebote EP2AGX65DF25C6NES
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
EP2AGX65DF25C6NES | Hersteller : Intel |
 Description: IC FPGA 252 I/O 572FBGAPackaging: Tray Package / Case: 572-BGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 60214 Supplier Device Package: 572-FBGA, FC (25x25) Number of LABs/CLBs: 2530 Total RAM Bits: 5371904 Number of I/O: 252 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |