Technische Details EP3C25F256C7ES Intel
Description: IC FPGA 156 I/O 256FBGA, Packaging: Tray, Package / Case: 256-LBGA, Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.15V ~ 1.25V, Number of Logic Elements/Cells: 24624, Supplier Device Package: 256-FBGA (17x17), Number of LABs/CLBs: 1539, Total RAM Bits: 608256, Part Status: Obsolete, Number of I/O: 156, DigiKey Programmable: Not Verified.
Weitere Produktangebote EP3C25F256C7ES
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
![]() |
EP3C25F256C7ES | Hersteller : Intel |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 24624 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 1539 Total RAM Bits: 608256 Part Status: Obsolete Number of I/O: 156 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |