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EPF6024AFC256-3 Intel

FLEX_6000_Programmable_Logic_Device_Family.pdf

Hersteller: Intel
Description: IC FPGA 219 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 24000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1960
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 196
Number of I/O: 219
DigiKey Programmable: Not Verified

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Technische Details EPF6024AFC256-3 Intel

Description: IC FPGA 219 I/O 256FBGA, Packaging: Tray, Package / Case: 256-BGA, Mounting Type: Surface Mount, Number of Gates: 24000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 3V ~ 3.6V, Number of Logic Elements/Cells: 1960, Supplier Device Package: 256-FBGA (17x17), Number of LABs/CLBs: 196, Number of I/O: 219, DigiKey Programmable: Not Verified.