ESQ-115-69-L-D Samtec Inc.
Hersteller: Samtec Inc.Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.735" (18.67mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 18.11 EUR |
| 10+ | 16.30 EUR |
| 100+ | 14.57 EUR |
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Technische Details ESQ-115-69-L-D Samtec Inc.
Description: CONN SOCKET 30POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.180" (4.57mm), Insulation Height: 0.735" (18.67mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote ESQ-115-69-L-D
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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ESQ-115-69-L-D | Hersteller : Samtec |
PC/104 Connectors Elevated Socket Strip, 0.100" Pitch |
Produkt ist nicht verfügbar |