ESQT-103-02-G-D-468 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN SOCKET 6POS 0.079 GOLD PCB
Connector Type: Elevated Socket
Packaging: Bulk
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Positions: 6
Mounting Type: Through Hole
Current Rating (Amps): 4.5A per Contact
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.468" (11.89mm)
Contact Length - Post: 0.382" (9.70mm)
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
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Technische Details ESQT-103-02-G-D-468 Samtec Inc.
Description: CONN SOCKET 6POS 0.079 GOLD PCB, Connector Type: Elevated Socket, Packaging: Bulk, Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 6, Mounting Type: Through Hole, Current Rating (Amps): 4.5A per Contact, Number of Rows: 2, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.468" (11.89mm), Contact Length - Post: 0.382" (9.70mm), Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm).