ESQT-115-02-GF-D-650 Samtec
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 12.34 EUR |
| 10+ | 11.25 EUR |
| 54+ | 8.98 EUR |
| 108+ | 8.52 EUR |
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Technische Details ESQT-115-02-GF-D-650 Samtec
Description: CONN SOCKET 30POS 0.079 GOLD PCB, Packaging: Tube, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 30, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Part Status: Active, Contact Length - Post: 0.200" (5.08mm), Insulation Height: 0.650" (16.50mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-115-02-GF-D-650
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| ESQT-115-02-GF-D-650 | Hersteller : Samtec Inc. |
Description: CONN SOCKET 30POS 0.079 GOLD PCB Packaging: Tube Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.200" (5.08mm) Insulation Height: 0.650" (16.50mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
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