ESQT-115-02-H-D-800 Samtec
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.61 EUR |
| 10+ | 18.13 EUR |
| 54+ | 16.51 EUR |
| 108+ | 16.02 EUR |
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Technische Details ESQT-115-02-H-D-800 Samtec
Description: CONN SOCKET 30POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 30, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Part Status: Active, Contact Length - Post: 0.050" (1.27mm), Insulation Height: 0.800" (20.32mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-115-02-H-D-800 nach Preis ab 22.81 EUR bis 26.31 EUR
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ESQT-115-02-H-D-800 | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 30POS 0.079 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.050" (1.27mm) Insulation Height: 0.800" (20.32mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
auf Bestellung 91 Stücke: Lieferzeit 10-14 Tag (e) |
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