ESQT-125-02-M-Q-790 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN SOCKET 100P 0.079 GOLD PCB
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Positions: 100
Mounting Type: Through Hole
Current Rating (Amps): 4.5A per Contact
Connector Type: Elevated Socket
Packaging: Tube
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Number of Rows: 4
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.790" (20.07mm)
Contact Length - Post: 0.060" (1.52mm)
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Technische Details ESQT-125-02-M-Q-790 Samtec Inc.
Description: CONN SOCKET 100P 0.079 GOLD PCB, Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 100, Mounting Type: Through Hole, Current Rating (Amps): 4.5A per Contact, Connector Type: Elevated Socket, Packaging: Tube, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Number of Rows: 4, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.790" (20.07mm), Contact Length - Post: 0.060" (1.52mm).