EVSC800-PI-2-K6 CR Technology
Hersteller: CR TechnologyDescription: Thermal Insulation Pad
Packaging: Sheet
Color: Gray
Material: Silicone
Thickness: 0.0063" (0.160mm)
Type: Ultra Thin Dielectric Sheet
Usage: Multi
Outline: 305.00mm x 305.00mm
Thermal Conductivity: 1.1W/m-K
Part Status: Active
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 84.48 EUR |
| 5+ | 75.68 EUR |
| 10+ | 66.88 EUR |
| 25+ | 58.08 EUR |
| 50+ | 49.28 EUR |
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Technische Details EVSC800-PI-2-K6 CR Technology
Description: Thermal Insulation Pad, Packaging: Sheet, Color: Gray, Material: Silicone, Thickness: 0.0063" (0.160mm), Type: Ultra Thin Dielectric Sheet, Usage: Multi, Outline: 305.00mm x 305.00mm, Thermal Conductivity: 1.1W/m-K, Part Status: Active.