EVSF100-65 CR Technology
Hersteller: CR Technology
Description: Thermal Pad (EverTherm)
Thermal Conductivity: 1.5W/m-K
Outline: 200.00mm x 300.00mm
Usage: Multi
Thermal Resistivity: 0.9°C/W
Type: Gap Filler Pad, Sheet
Thickness: 0.1181" (3.000mm)
Color: White
Packaging: Sheet
| Anzahl | Preis |
|---|---|
| 1+ | 44 EUR |
| 5+ | 38.72 EUR |
| 10+ | 35.2 EUR |
| 25+ | 29.92 EUR |
| 50+ | 24.64 EUR |
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Technische Details EVSF100-65 CR Technology
Description: Thermal Pad (EverTherm), Thermal Conductivity: 1.5W/m-K, Outline: 200.00mm x 300.00mm, Usage: Multi, Thermal Resistivity: 0.9°C/W, Type: Gap Filler Pad, Sheet, Thickness: 0.1181" (3.000mm), Color: White, Packaging: Sheet.