EVSF100FG-A1-90 CR Technology
Hersteller: CR Technology
Description: Thermal Pad (EverTherm)
Packaging: Sheet
Color: White
Thickness: 0.0394" (1.000mm)
Type: Gap Filler Pad, Sheet
Thermal Resistivity: 0.9°C/W
Usage: Multi
Outline: 200.00mm x 300.00mm
Thermal Conductivity: 1.5W/m-K
Backing, Carrier: Fiberglass
Part Status: Active
Description: Thermal Pad (EverTherm)
Packaging: Sheet
Color: White
Thickness: 0.0394" (1.000mm)
Type: Gap Filler Pad, Sheet
Thermal Resistivity: 0.9°C/W
Usage: Multi
Outline: 200.00mm x 300.00mm
Thermal Conductivity: 1.5W/m-K
Backing, Carrier: Fiberglass
Part Status: Active
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 61.6 EUR |
| 5+ | 52.8 EUR |
| 10+ | 44 EUR |
| 25+ | 35.2 EUR |
| 50+ | 29.92 EUR |
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Technische Details EVSF100FG-A1-90 CR Technology
Description: Thermal Pad (EverTherm), Packaging: Sheet, Color: White, Thickness: 0.0394" (1.000mm), Type: Gap Filler Pad, Sheet, Thermal Resistivity: 0.9°C/W, Usage: Multi, Outline: 200.00mm x 300.00mm, Thermal Conductivity: 1.5W/m-K, Backing, Carrier: Fiberglass, Part Status: Active.