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EVSF500-75

EVSF500-75 CR Technology


02.%20EVSF500%203.0W.pdf Hersteller: CR Technology
Description: Thermal Pad (EverTherm)
Packaging: Sheet
Color: Blue
Thickness: 0.0394" (1.000mm)
Type: Gap Filler Pad, Sheet
Thermal Resistivity: 0.45°C/W
Usage: Thermally Conductive
Outline: 200.00mm x 300.00mm
Thermal Conductivity: 3.0W/m-K
Part Status: Active
auf Bestellung 100 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+79.2 EUR
5+ 61.6 EUR
10+ 52.8 EUR
25+ 47.52 EUR
50+ 44 EUR
Produktrezensionen
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Technische Details EVSF500-75 CR Technology

Description: Thermal Pad (EverTherm), Packaging: Sheet, Color: Blue, Thickness: 0.0394" (1.000mm), Type: Gap Filler Pad, Sheet, Thermal Resistivity: 0.45°C/W, Usage: Thermally Conductive, Outline: 200.00mm x 300.00mm, Thermal Conductivity: 3.0W/m-K, Part Status: Active.