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F3L500R12N3H7B66BPSA1 Infineon Technologies


F3L500R12N3H7B66BPSA1.pdf
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 510A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.23V @ 15V, 500A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench
Current - Collector (Ic) (Max): 510 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Cutoff (Max): 10 µA
Input Capacitance (Cies) @ Vce: 57.9 nF @ 25 V
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Technische Details F3L500R12N3H7B66BPSA1 Infineon Technologies

Description: IGBT MODULE 1200V 510A, Packaging: Tray, Package / Case: Module, Mounting Type: Chassis Mount, Input: Standard, Configuration: Full Bridge, Operating Temperature: -40°C ~ 175°C (TJ), Vce(on) (Max) @ Vge, Ic: 2.23V @ 15V, 500A, NTC Thermistor: Yes, Supplier Device Package: Module, IGBT Type: Trench, Current - Collector (Ic) (Max): 510 A, Voltage - Collector Emitter Breakdown (Max): 1200 V, Current - Collector Cutoff (Max): 10 µA, Input Capacitance (Cies) @ Vce: 57.9 nF @ 25 V.