F871BI104M330L KEMET
                                                Hersteller: KEMETDescription: CAP FILM POLYPROP RAD X1
Packaging: Tape & Box (TB)
Tolerance: ±20%
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 110°C
Applications: EMI, RFI Suppression
Lead Spacing: 0.591" (15.00mm)
Termination: PC Pins
Ratings: X1
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - AC: 330V
Voltage Rating - DC: 800V
Height - Seated (Max): 0.689" (17.50mm)
Capacitance: 0.1 µF
Size / Dimension: 0.709" L x 0.236" W (18.00mm x 6.00mm)
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Technische Details F871BI104M330L KEMET
Description: CAP FILM POLYPROP RAD X1, Packaging: Tape & Box (TB), Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 0.591" (15.00mm), Termination: PC Pins, Ratings: X1, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 330V, Voltage Rating - DC: 800V, Height - Seated (Max): 0.689" (17.50mm), Capacitance: 0.1 µF, Size / Dimension: 0.709" L x 0.236" W (18.00mm x 6.00mm). 
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            Verfügbarkeit             | 
        Preis | 
|---|---|---|---|---|---|
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        F871BI104M330L | Hersteller : KEMET | 
            
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