FDMM016GCE-3201 Flexxon Pte Ltd
Hersteller: Flexxon Pte Ltd
Description: FXADV II MICROSD 16GB 3D PSLC DI
Packaging: Tray
Memory Size: 16GB
Memory Type: microSD™
Operating Temperature: -40°C ~ 85°C
Technology: pSLC
Description: FXADV II MICROSD 16GB 3D PSLC DI
Packaging: Tray
Memory Size: 16GB
Memory Type: microSD™
Operating Temperature: -40°C ~ 85°C
Technology: pSLC
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 67.85 EUR |
| 10+ | 62.92 EUR |
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Technische Details FDMM016GCE-3201 Flexxon Pte Ltd
Description: FXADV II MICROSD 16GB 3D PSLC DI, Packaging: Tray, Memory Size: 16GB, Memory Type: microSD™, Operating Temperature: -40°C ~ 85°C, Technology: pSLC.