FEMC032GBB-T740 Flexxon Pte Ltd
Hersteller: Flexxon Pte Ltd
Description: IC FLSH 256GBIT EMMC 5.1 153FBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (TLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-FBGA (11.5x13)
Part Status: Active
Memory Interface: eMMC_5.1
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
Description: IC FLSH 256GBIT EMMC 5.1 153FBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 256Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (TLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-FBGA (11.5x13)
Part Status: Active
Memory Interface: eMMC_5.1
Memory Organization: 32G x 8
DigiKey Programmable: Not Verified
auf Bestellung 264 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 60.03 EUR |
10+ | 55.68 EUR |
25+ | 53.69 EUR |
40+ | 52.35 EUR |
80+ | 45.87 EUR |
230+ | 44.61 EUR |
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Technische Details FEMC032GBB-T740 Flexxon Pte Ltd
Description: IC FLSH 256GBIT EMMC 5.1 153FBGA, Packaging: Tray, Package / Case: 153-VFBGA, Mounting Type: Surface Mount, Memory Size: 256Gbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 105°C, Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NAND (TLC), Clock Frequency: 200 MHz, Memory Format: FLASH, Supplier Device Package: 153-FBGA (11.5x13), Part Status: Active, Memory Interface: eMMC_5.1, Memory Organization: 32G x 8, DigiKey Programmable: Not Verified.